4
edits
Changes
Jump to navigation
Jump to search
→Mechanical Characteristics: Description of proper, gentle removal of camera module.
Line 784:
Line 784:
+
+
=== Mechanical Characteristics ===
=== Mechanical Characteristics ===
−The camera component is mounted on the bottom surface of the circuit board.
+The camera component is mounted on the bottom surface of the circuit board. The camera module itself is mounted in a socket perpendicular to the circuit board; to remove just the camera module, no desoldering is required. The process is as follows:
+First, orient the camera so that you are looking into the lens with the PCB horizontal and below the lens.. There are four metal clips, two on each of the
+vertical sides of the socket. Use something tiny to slide between each metal clip and the camera module: maybe wire wrap wire? Then look at the back of the camera module, opposite the lens. There is a small rectangular hole in the middle of each vertical side of the socket. Use a pin or something to pry/press the camera module out.
+Once the camera module is free of its socket, it may be further disassembled by gently prising up the tiny PCB with gold contacts; this is gently glued to the module's structure, but will come loose without damage. At this point you have three pieces: the camera socket, still attached to the Wiimote PCB, the camera module housing, complete with lens and dichroic filter (of unknown optical properties), and a tiny PCB with the camera chip and eight gold contacts on the bottom.
=== Optical Characteristics ===
=== Optical Characteristics ===