Changes

Hardware/NAND (view source)

Revision as of 00:59, 14 April 2008

103 bytes added , 00:59, 14 April 2008

add alternate part

Line 20: Line 20:

The NAND flash driver inside boot2 and IOS supports the following chip IDs:

−

Hynix: ad 76 / ad f1 / ad dc (64MB = [http://www.hynix.com/datasheet/pdf/flash/HY27US(08_16)12(1_2)B%20Series(Rev0.5).pdf HY27US0812(1/2)B], 128MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF(08_16)1G2A%20Series(Rev0.4).pdf HY27UF081G2A], 512MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF084G2M%20Series(Rev.0.7).pdf HY27UF084G2M])

+

Hynix: ad 76 / ad f1 / ad dc (64MB = [http://www.hynix.com/datasheet/pdf/flash/HY27US(08_16)12(1_2)B%20Series(Rev0.5).pdf HY27US0812(1/2)B], 128MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF(08_16)1G2A%20Series(Rev0.4).pdf HY27UF081G2A], 512MB = [http://www.hynix.com/datasheet/pdf/flash/HY27UF084G2M%20Series(Rev.0.7).pdf HY27UF084G2M] or [http://www.hynix.co.kr/datasheet/pdf/flash/HY27UG(08_16)4G(2_D)M_Series(Rev.0.7).pdf HY27UG084G2M])

Samsung: ec 76 / ec f1 / ec da / ec dc (64M [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=158&partnum=K9F1208U0C K9F1208U0C] /128 [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=159&partnum=K9F1G08U0B K9F1G08U0B]/256 [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=159&partnum=K9F2G08U0A K9F2G08U0A]/512 = [http://www.samsung.com/global/business/semiconductor/productInfo.do?fmly_id=159&partnum=K9F4G08U0A K9F4G08U0A])

Toshiba: 98 76 / 98 f1 / 98 da (64/128/512)

Bushing

Bureaucrats, Check users, oversight, Administrators

834

edits