In memory of Ben “bushing” Byer, who passed away on Monday, February 8th, 2016.

Changes

Jump to navigation Jump to search
233 bytes added ,  20:36, 10 April 2008
chip info
Line 9: Line 9:  
*Blocks 0x1C0 - ?    : boot2  (second copy)
 
*Blocks 0x1C0 - ?    : boot2  (second copy)
 
** boot2 is the third-stage bootloader; it is stored in a modified WAD format, including a [[ticket]] that is encrypted with the common key and signed.
 
** boot2 is the third-stage bootloader; it is stored in a modified WAD format, including a [[ticket]] that is encrypted with the common key and signed.
 +
 +
 +
The NAND flash driver inside boot2 and IOS supports the following chip IDs:
 +
 +
Hynix: ad 76 / ad f1 / ad dc  (64MB, 128MB, 512MB)
 +
Samsung: ec 76 / ec f1 / ec da / ec dc (64/128/256/512)
 +
Toshiba: 98 76 / 98 f1 / 98 da (64/128/512)

Navigation menu