Difference between revisions of "Hollywood"
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| − | [http://en.wikipedia.org/wiki/Hollywood_(graphics_chip) | + | The security chip in the [[Wii]] is known as '''Hollywood'''; it bears the logos of NEC (who presumably manufactured the chip), ATI (who designed the [[Hardware/GX|GPU]] inside), and BroadOn (who designed the [[Starlet]] "I/O Bridge"). |
| + | |||
| + | Its hardware is documented on the [[Hardware]] article and subpages. Hardware inside includes the [[Hardware/GX|GX]], [[boot0]] ROM, [[Hardware/OTP|OTP]], and Starlet | ||
| + | |||
| + | [http://en.wikipedia.org/wiki/Hollywood_(graphics_chip) Hollywood article at Wikipedia] | ||
| + | |||
| + | == Pinout (Hollywood, Hollywood AA) == | ||
| + | The Hollywood chip is 2 or 3 flip-chip dies bonded to a BGA substrate, with a 30 x 30 (or later, 28x28) grid of balls to connect it to the rest of the circuit. Most balls are connected to other layers by way of vias; some signals are routed completely on the top layer. | ||
| + | |||
| + | (Please help verify and complete this pinout with a continuity tester! This pinout is for the earlier 30x30 version of the Hollywood; the 28x28 package has a completely different pinout.) | ||
| + | |||
| + | Pins grouped by function | ||
| + | {| border=1 | ||
| + | | Function || Balls | ||
| + | |- | ||
| + | | Ground || A1, A15, A17, A30, B4, B16, B17, B18, B29, C17, C18, C19, C24, C25, C27, C29, D4, D25, D26, D27 | ||
| + | |- | ||
| + | | NAND Flash || C1, C2, D1, D2, D3, E1, E2, E3, E4, F1, F2, F3, F4, F5, G4, G5, H4, J1 | ||
| + | |- | ||
| + | | GDDR3 || R2, R3, T1, U1, U2, V2, W1, X1, Y3, Y4, AA2, AA3, AA4, AA5, AB2, AB3, AB4 | ||
| + | |- | ||
| + | | USB || A26, A27, A28, B26, B27, B28 | ||
| + | |- | ||
| + | | AVE || D28, E28, G28, H28, H29, J27, J28, J29, J30 | ||
| + | |} | ||
| + | |||
| + | == Pinout (Hollywood-1, Hollywood-2) == | ||
| + | {{Stub}} | ||
| + | |||
| + | == Hollywood ID == | ||
| + | It seems to be implied by the formulas used for the [[Wii Number]] that the Hollywood ID is a 32bit unsigned int.{{check}} | ||
| + | |||
| + | == See also == | ||
| + | * [[Hollywood/Registers|Hollywood Registers]] | ||
| + | * [[Hollywood/GPIOs|Hollywood GPIOs]] | ||
| + | * [[Hollywood/IRQs|Hollywood IRQs]] | ||
Latest revision as of 19:17, 26 May 2022
The security chip in the Wii is known as Hollywood; it bears the logos of NEC (who presumably manufactured the chip), ATI (who designed the GPU inside), and BroadOn (who designed the Starlet "I/O Bridge").
Its hardware is documented on the Hardware article and subpages. Hardware inside includes the GX, boot0 ROM, OTP, and Starlet
Hollywood article at Wikipedia
Pinout (Hollywood, Hollywood AA)
The Hollywood chip is 2 or 3 flip-chip dies bonded to a BGA substrate, with a 30 x 30 (or later, 28x28) grid of balls to connect it to the rest of the circuit. Most balls are connected to other layers by way of vias; some signals are routed completely on the top layer.
(Please help verify and complete this pinout with a continuity tester! This pinout is for the earlier 30x30 version of the Hollywood; the 28x28 package has a completely different pinout.)
Pins grouped by function
| Function | Balls |
| Ground | A1, A15, A17, A30, B4, B16, B17, B18, B29, C17, C18, C19, C24, C25, C27, C29, D4, D25, D26, D27 |
| NAND Flash | C1, C2, D1, D2, D3, E1, E2, E3, E4, F1, F2, F3, F4, F5, G4, G5, H4, J1 |
| GDDR3 | R2, R3, T1, U1, U2, V2, W1, X1, Y3, Y4, AA2, AA3, AA4, AA5, AB2, AB3, AB4 |
| USB | A26, A27, A28, B26, B27, B28 |
| AVE | D28, E28, G28, H28, H29, J27, J28, J29, J30 |
Pinout (Hollywood-1, Hollywood-2)
| This article is a stub. You can help WiiBrew by expanding it. |
Hollywood ID
It seems to be implied by the formulas used for the Wii Number that the Hollywood ID is a 32bit unsigned int.[check]