Difference between revisions of "Hollywood"
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Pins grouped by function | Pins grouped by function | ||
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| Function || Balls | | Function || Balls | ||
+ | |- | ||
+ | | Ground || A1, A15, A17, A30, B4, B16, B17, B18, B29, C17, C18, C19, C24, C25, C27, C29, D4, D25, D26, D27 | ||
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| NAND Flash || C1, C2, D1, D2, D3, E1, E2, E3, E4, F1, F2, F3, F4, F5, G4, G5, H4, J1 | | NAND Flash || C1, C2, D1, D2, D3, E1, E2, E3, E4, F1, F2, F3, F4, F5, G4, G5, H4, J1 |
Revision as of 09:49, 2 October 2011
The graphics chip in the Wii is codenamed "Hollywood"; it bears the logos of NEC (who presumably manufactured the chip), ATI (who designed the GPU), and BroadOn (who designed the Starlet "I/O Bridge").
Its graphics capabilities are similar to that of the GameCube's Flipper, except running at a higher clock speed.
Its hardware is documented on the Hardware article and subpages.
Hollywood article at Wikipedia
Pinout
The Hollywood chip is 2 or 3 flip-chip dies bonded to a BGA substrate, with a 30 x 30 (or later, 28x28) grid of balls to connect it to the rest of the circuit. Most balls are connected to other layers by way of vias; some signals are routed completely on the top layer.
(Please help verify and complete this pinout with a continuity tester! This pinout is for the earlier 30x30 version of the Hollywood; the 28x28 package has a completely different pinout.)
Pins grouped by function
Function | Balls |
Ground | A1, A15, A17, A30, B4, B16, B17, B18, B29, C17, C18, C19, C24, C25, C27, C29, D4, D25, D26, D27 |
NAND Flash | C1, C2, D1, D2, D3, E1, E2, E3, E4, F1, F2, F3, F4, F5, G4, G5, H4, J1 |
GDDR3 | R2, R3, T1, U1, U2, V2, W1, X1, Y3, Y4, AA2, AA3, AA4, AA5, AB2, AB3, AB4 |
USB | A26, A27, A28, B26, B27, B28 |
AVE | D28, E28, G28, H28, H29, J27, J28, J29, J30 |
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