Changes

The security chip in the [[Wii]] is known as '''Hollywood'''; it bears the logos of NEC (who presumably manufactured the chip), ATI (who designed the [[Hardware/GX|GPU]] inside), and BroadOn (who designed the [[Starlet]] "I/O Bridge").

The security chip in the [[Wii]] is known as '''Hollywood'''; it bears the logos of NEC (who presumably manufactured the chip), ATI (who designed the [[Hardware/GX|GPU]] inside), and BroadOn (who designed the [[Starlet]] "I/O Bridge").

Its hardware is documented on the [[Hardware]] article and subpages. Hardware inside includes the GX, [[boot0]] ROM, [[Hardware/OTP|OTP]], and Starlet

Its hardware is documented on the [[Hardware]] article and subpages. Hardware inside includes the [[Hardware/GX|GX]], [[boot0]] ROM, [[Hardware/OTP|OTP]], and Starlet

[http://en.wikipedia.org/wiki/Hollywood_(graphics_chip) Hollywood article at Wikipedia]

[http://en.wikipedia.org/wiki/Hollywood_(graphics_chip) Hollywood article at Wikipedia]

== Pinout ==

== Pinout (Hollywood, Hollywood AA) ==

The Hollywood chip is 2 or 3 flip-chip dies bonded to a BGA substrate, with a 30 x 30 (or later, 28x28) grid of balls to connect it to the rest of the circuit. Most balls are connected to other layers by way of vias; some signals are routed completely on the top layer.

The Hollywood chip is 2 or 3 flip-chip dies bonded to a BGA substrate, with a 30 x 30 (or later, 28x28) grid of balls to connect it to the rest of the circuit. Most balls are connected to other layers by way of vias; some signals are routed completely on the top layer.

| AVE || D28, E28, G28, H28, H29, J27, J28, J29, J30

| AVE || D28, E28, G28, H28, H29, J27, J28, J29, J30

|}

|}

{{Stub}}

{{Stub}}